The weak mechanical and thermal interface in Copper based Metal Matrix Composites (MMCs) reinforced by carbon fibers is the background of this research study In order to investigate the mechanical adhesion strength and the thermal contact resistance between copper and carbon, a simplified model system based on coated flat carbon substrates has been used. Cu coatings of approximately 1 mum thickness on intermediate Ti bond layers have been deposited on carbon substrates by a sputter deposition process. The resulting different adhesion strengths between coating and substrate have been measured by means of a pull-off method, and non-destructive photothermal method, giving information on the depth-resolved thermal properties of the samples has been used to determine the Thermal Contact Resistance (TCR). By combining the results of mechanical adhesion tests and of photothermal IR radiometry, the correlation of the mechanical adhesion of Cu coatings on Carbon surfaces with the interfacial thermal contact resistance has been analysed. (C) 2003 Elsevier Science B.V. All rights reserved.