TiNiCti shape memory alloy films were deposited at different temperatures on heated (1 0 0) Si cantilever-type substrates. The films are crystalline when deposited above 200 degreesC. The stress relief observed in the TiNiCu/Si bimorphs depends on the composition and the: deposition temperature. For lower Cu contents a B2 --> R-phase --> B19' sequence of transformations was observed for films that start to transform under a low thermoelastic stress and a B2 --> B19' sequence when the stress at the onset of the transformation is high. For higher Cu content the sequence of transformation observed was B2 --> B19 --> B19' and B2 --> B19' for low and high stress, respectively. (C) 2003 Elsevier Science B.V. All rights reserved.