The present paper describes a new direct chemical plating method of copper, called Dynamic Chemical Plating. This low cost technology is based on spraying separate aqueous solutions containing copper metallic ions and Borohydride reducing agent. It is able to plate chemical copper at 30 mum/h at room temperature and may be used as an industrial process for metallizing polymers and non-conductors in general.The copper plating dynamic parameters were studied as well as the substrate characteristics in order to be metallized. The wettability of the plastics surfaces and the use of a coupling agent plate, as an under-coat metallic layer, are major important parameters to start plating and increase the adhesion of metallic copper layer to the substrate. Effects of pre-treatment conditions such as corona discharge, the plating kinetics and electrical properties of the copper film are also investigated. (C) 2003 Kluwer Academic Publishers.