화학공학소재연구정보센터
Journal of the Electrochemical Society, Vol.150, No.11, C794-C797, 2003
Rapid production of high aspect ratio copper wires via nonsubmerged anodic jets impinging on cathode substrates
High geometric aspect ratio, low porosity copper wires were produced by an electroplating technique employing horizontal nonsubmerged jet flow through nozzle anodes, impinging on vertical cathode surfaces. The technique involves an initial deposition of the copper spot whose diameter is controlled by the nozzle diameter. As the deposit tip grew as a circular wire toward the nozzle anode, the copper substrate was continuously displaced away from the nozzle by a computer controlled motor. A typical wire has an aspect ratio of about 90, and a porosity of about 20%. (C) 2003 The Electrochemical Society. All rights reserved.