The ability to deposit thin films onto glass at ever increasing deposition speeds and greater precision relies on a complex interplay of technological components. Pumping speed and dynamics, magnetron design, applied power waveform, target fabrication, gas distribution and the process control algorithms linking these components are all critical determinants in pushing the limits of sputter technology and reducing coating costs. Over the last several years, advances in all of these areas have come together in a maturing technology with advanced capabilities of high rate deposition of a variety of materials. This paper will review the state of the art in high rate deposition and evaluate technology constraints on future developments. The effects of new target materials, power technologies, magnetron geometries, gas flow dynamics and control approaches on sputter system productivity will be critically reviewed based on production experience. (C) 2003 Elsevier B.V. All rights reserved.