Microcontact printing (muCP) is an effective way to generate micrometer- or submicrometer-sized patterns on a variety of substrates. However, the fidelity of the final pattern depends critically on the coupled phenomena of stamp deformation, fluid transfer between surfaces, and the ability of the ink to self-assemble on the substrate. In particular, stamp deformation can produce undesirable effects that limit the practice and precision of muCP. Experimental observations and comparison with theoretical predictions are presented here for three of the most undesirable consequences of stamp deformation: (1) roof collapse of low aspect ratio recesses, (2) buckling of high aspect ratio plates, and (3) lateral sticking of high aspect ratio plates. Stamp behavior was observed visually with an inverted optical microscope while load-displacement data were collected during compression and retraction of stamps. Additionally, a "robotic stamper" was used to deliver ink patterns in precise locations on substrates. These monomolecular ink patterns were then observed in high contrast using the surface potential scanning mode of an atomic force microscope. Theoretical models based on continuum mechanics were used to accurately predict both physical deformation of the stamp and the resultant inking patterns. The close agreement between these models and the experimental data presented clearly demonstrates the essential considerations one must weigh when designing stamp geometry, material, and loading conditions for optimal pattern fidelity.