Fabrication of Photoimageable Silver Paste for Low-Temperature Cofiring Using Acrylic Binder Polymers and Photosensitive Materials

Seong-Dae Park; Myong-Jae Yoo; Nam-Kee Kang; Jong-Chul Park; Jin-Kyu Lim; Dong-Kook Kim

Macromolecular Research, Vol.12, No.4, 391-398, August, 2004

Seong-Dae Park^†, Myong-Jae Yoo, Nam-Kee Kang, Jong-Chul Park, Jin-Kyu Lim¹, and Dong-Kook Kim¹

High Frequency Materials Research Center, Korea Electronics Technology Institute, Pyungtaek 451-865, Korea
¹Department of Chemistry & Material Science, Hanyang University, Ansan 426-791, Korea

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Thick-film photolithography is a new technology that combines lithography processes, such as exposure and development, with the conventional thick-film process applied to screen-printing. In this study, we developed a low-temperature cofireable silver paste applicable for thick-film processing to form fine lines using photolithographic technologies. The optimum paste composition for forming fine lines was investigated. The effect of processing parameters, such as the exposing dose, had on the fine-line resolution was also investigated. As the result, we found that the type of polymer and monomer, the silver powder loading, and the amount of photoinitiator were the main factors affecting the resolution of the fine lines. The developed photoimageable silver paste was printed on a low-temperature cofireable green sheet, dried, exposed, developed in an aqueous process, laminated, and then fired. Our results demonstrate that thick-film fine lines having widths < 20 μm can be obtained after cofiring.

Keywords:photoimageable;silver paste;low-temperature cofiring;thick-film photolithography;fine-line resolution

[References]

Gacusan RL, Proc. 35th International Symposium on Microelectronics, 188 (2002)
Lim K, Pinel S, Davis M, Sutono A, Lee C, Heo D, Obatoynbo A, Laskar J, Tantzeris E, Tummala R, IEEE Microwave Magazine, March (2002)
Tummala R, Advancing Microelectronics, May/June, 31 (1999)
Park JH, Park JK, Ceramist, 4, 41 (2001)
Anderson D, Proc. Ceramic Interconnect Technology: The Next Generation, 165 (2003)
Thust H, Thelemann T, Ehrhardt W, Drue K, Munnich R, Muller J, Keynote Presentation in IMAPS Conference and exhibition on Ceramic Interconnect Technology: The Next Generation, April 7-9 Denver (2003)
Park SD, Kang HG, Park YH, Mun JD, J. Microelectronics & Packaging Soc., 6, 25 (1999)
Tredinnick M, Barnwell P, Malanga D, Proc. 34th International Symposium on Microelectronics, 676 (2001)
Skurski M, Smith M, Draudt R, Amey D, Horowitz S, Champ M, Int. J. Microcircuits and Electronic Packaging, 21, 355 (1998)
Park SD, Lee YS, Cho HM, Lee WS, Park JC, J. Microelectrionics & Packaging Soc., 8, 69 (2001)
Braithwaite M, Davidson S, Holman R, Lowe C, Oldring PKT, Salim MS, Wall C, SITA TEchnology, London (1991)
Jung JC, Polym.(Korea), 10(6), 570 (1986)
Hoyle CE, Kinstle JF, Radiation Curing of Polymeric Materials, American Chemical Society, Washigton DC (1990)
Won J, Yoon Y, Kang YS, Macromol. Res., 10(2), 80 (2002)
Yun HC, Im SH, Suh DJ, Park OO, Kwon MH, Macromol. Res., 11(4), 236 (2003)
Lee KH, Kim BK, Korea Polym. J., 4(1), 1 (1996)
Park LS, Keum CD, Seok JW, Ahm W, Korea Polym. J., 6(4), 333 (1998)
http://www.dupont.com/mcm/product/fodel.html
http://www.dupont.com/mcm/pdfs/fodel.pdf
Hong JH, UV Curable Coating, Publishing Department of Chosun University (2002)
Chang CR, Jean JH, J. Am. Ceram. Soc., 81, 2805 (1998)

[Referenced By]

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[1] Gacusan RL, Proc. 35th International Symposium on Microelectronics, 188 (2002)

[2] Lim K, Pinel S, Davis M, Sutono A, Lee C, Heo D, Obatoynbo A, Laskar J, Tantzeris E, Tummala R, IEEE Microwave Magazine, March (2002)

[3] Tummala R, Advancing Microelectronics, May/June, 31 (1999)

[4] Park JH, Park JK, Ceramist, 4, 41 (2001)

[5] Anderson D, Proc. Ceramic Interconnect Technology: The Next Generation, 165 (2003)

[6] Thust H, Thelemann T, Ehrhardt W, Drue K, Munnich R, Muller J, Keynote Presentation in IMAPS Conference and exhibition on Ceramic Interconnect Technology: The Next Generation, April 7-9 Denver (2003)

[7] Park SD, Kang HG, Park YH, Mun JD, J. Microelectronics & Packaging Soc., 6, 25 (1999)

[8] Tredinnick M, Barnwell P, Malanga D, Proc. 34th International Symposium on Microelectronics, 676 (2001)

[9] Skurski M, Smith M, Draudt R, Amey D, Horowitz S, Champ M, Int. J. Microcircuits and Electronic Packaging, 21, 355 (1998)

[10] Park SD, Lee YS, Cho HM, Lee WS, Park JC, J. Microelectrionics & Packaging Soc., 8, 69 (2001)

[11] Braithwaite M, Davidson S, Holman R, Lowe C, Oldring PKT, Salim MS, Wall C, SITA TEchnology, London (1991)

[12] Jung JC, Polym.(Korea), 10(6), 570 (1986)

[13] Hoyle CE, Kinstle JF, Radiation Curing of Polymeric Materials, American Chemical Society, Washigton DC (1990)

[14] Won J, Yoon Y, Kang YS, Macromol. Res., 10(2), 80 (2002)

[15] Yun HC, Im SH, Suh DJ, Park OO, Kwon MH, Macromol. Res., 11(4), 236 (2003)

[16] Lee KH, Kim BK, Korea Polym. J., 4(1), 1 (1996)

[17] Park LS, Keum CD, Seok JW, Ahm W, Korea Polym. J., 6(4), 333 (1998)

[18] http://www.dupont.com/mcm/product/fodel.html

[19] http://www.dupont.com/mcm/pdfs/fodel.pdf

[20] Hong JH, UV Curable Coating, Publishing Department of Chosun University (2002)

[21] Chang CR, Jean JH, J. Am. Ceram. Soc., 81, 2805 (1998)