Previous Article Next Article Table of Contents Chemical Engineering & Technology, Vol.26, No.12, 1235-1239, 2003 DOI10.1002/ceat.200303050 Export Citation Characterization of slurries used for chemical-mechanical polishing (CMP) in the semiconductor industry Kuntzsch T, Witnik U, Hollatz M, Stintz M, Ripperger S Please enable JavaScript to view the comments powered by Disqus.
