Electrodeposition of lead on copper was investigated experimentally, mainly the adherence of the lead plate and, if possible to obtain films with characteristics suitable for use in lead battery technology. Under potentiodynamic and chronopotentiometric conditions, the lead films deposited from alkaline glycerol solutions on copper were sufficiently adherent for this substrate showed to be potentially useful as a cathode for lead deposition. Scanning electron microscopy (SEM) photographs showed that there was no dendritic growth of lead film on copper substrate, which is thus acceptable as a support in battery plates. With the help of energy dispersive X-ray spectroscopy (EDS), an explanation has been offered for the adherence of the lead deposits to the copper substrate. It was concluded that lead film deposited prior to lead bulk deposition favors the adhesion of the electrodeposits. (C) 2004 Elsevier B.V. All rights reserved.