Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.22, No.3, 1214-1214, 2004 Export Citation Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection (vol 21, pg 33, 2003) Kim JJ, Kim SK, Lee CH, Kim YS Please enable JavaScript to view the comments powered by Disqus.
