Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.22, No.4, L11-L14, 2004 DOI10.1116/1.1771668 Export Citation Fabrication of 100 nm pitch copper interconnects by electron beam lithography Wu W, Jonckheere R, Tokei Z, Brongersma SH, Van Hove M, Maez K Please enable JavaScript to view the comments powered by Disqus.
