Solvent-assisted polymer-bonding lithography based on surface adhesion to the transfer pattern between the polymer films is presented. Its primary feature is the application of solvent vapor to enhance the adhesion between the polymers on the elastomeric polydimethylsiloxane mold and the substrate. When the mold is lifted off, the pattern is transferred to the substrate, assuming that the work of adhesion of the polymer/mold and the polymer/substrate was permitted. Solvent-assisted polymer-bonding lithography can fabricate micrometer and submicron patterns between the same and different polymers on the planar and nonplanar substrates at low temperatures and pressures. (C) 2005 American Vacuum Society.