Previous Article Next Article Table of Contents Journal of Materials Science, Vol.40, No.6, 1533-1537, 2005 DOI10.1007/s10853-005-0598-7 Export Citation Moisture effect on fracture strength of molding compounds (MCs) for electronic packaging in a wide temperature range Zhu WH, Ang S, Gan SL Please enable JavaScript to view the comments powered by Disqus.
