Composite polyimide thin films with reduced surface resistivities were prepared using preformed and soluble hydroxyl polyimide (HPI) and polythiophene acetic acid (PTAA). Casting of blends and layer-by-layer assembly were employed to fabricate the thin films. In either technique, HPI and PTAA chains are cross-linked through ester formation, giving rise to thermal and mechanical robustness. Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy and Ultraviolet-visible absorption spectroscopy were used to investigate the formation of the composite films. Surface resistivity measurements showed that the values were well-suited for antistatic applications. The composite structures also showed good stability to thermal and ambient environments. (c) 2004 Elsevier B.V. All rights reserved.