Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long time Vickers indentation testing at room temperature. Based on the steady-state power law creep relationship, the stress exponents were determined for the cast and wrought materials in the homogenized and unhomogenized conditions. The stress exponent values of 4.5 and 12, depending on the processing route of the material, are in good agreement with those reported for the same material in conventional creep testing at room temperature. The results are discussed on the basis of the microstructural features developed during different processing routes of the material. (c) 2005 Springer Science + Business Media, Inc.