Non-porous pads containing varying amounts of embedded. water-soluble particles (WSP) have been characterized and compared to porous pads for interlayer dielectric chemical mechanical planarization (CMP) applications. In situ infrared imaging of the pad shows temperatures increasing as a function of pressure and velocity. Results also indicate that pad surface temperatures can increase up to 10 degrees C for a 1-min polish. Thermal information I proves to be a critical component in explaining the viscoelastic response of the pad as a result of CNP process temperatures. Glass transition temperatures for WSP-containing pads occur within standard CMP operating temperatures (20-40 degrees C). Comparative storage modulus trends demonstrate steeper decreasing slopes with increasing temperature for WSP-containing pads than the IC-1000. The-gradually decreasing slope for the IC-1000 is a sign of a highly cross-linked material. WSP-containing pads also exhibit a greater energy loss due to beat as quantified by the difference in tan delta. Regardless of whether a pad is new or used, dynamic mechanical analysis results indicate similar bulk properties. (c) 2005 Elsevier B.V All rights reserved.