We report a new process combining reactive ion etching (RIE) and deep RIE (DRIE) tools for microfabrication of high-aspect-ratio (HAR) silicon tips with heights > 40 mu m and aspect ratios of 7. We integrate atomic force microscope (AFM) cantilevers with HAR tips and compare AFM scans using an HAR tip and a commercial tip. Our results demonstrate the advantage of HAR tips for metrology applications. 0 2005 American Vacuum Society.