The effect of an external in-plane magnetic field (B=0.1 T) on the electrodeposition of NiCu films from a citrate bath solution was studied. The application of the magnetic field showed the following effects: (i) an increase of limiting current for Cu2+ reduction, (ii) an increase of plating rate of NiCu by similar to 17%, (iii) an increase of Cu content in NiCu deposit of 4.9%, (iv) a decrease of tensile stress on NiCu films, (v) a strong influence on the texture, and (vi) a strong influence on surface morphology resulting in three-dimensional (3D) growth without applied magnetic field and 2D growth with applied magnetic field.