This study extends the application of a previously presented flash heating removal rate model to a series of interlayer dielectric (ILD) chemical mechanical planarization (CMP) experiments using Freudenberg XY and perforated groove pads along with Fujimi PL-4217 fumed silica slurry. Polishing tests were conducted at platen temperatures ranging from approximately 24 to 45 degrees C. Application of the model indicates its versatility when using different tool sets, pad types, and slurry chemistries compared to those originally used to develop the model. The flash heating removal rate model was shown to predict experimental data from this study by an average root mean square (rms) error of 164 angstrom/min. When compared to the traditional Preston model, which predicted the data by an average rms of 300 angstrom/min, the flash heating model provides better predictive accuracy and enables one to predict previously assumed scatter associated with removal rate in a systematic and comprehensible manner. (c) 2005 The Electrochemical Society. All rights reserved.