The electrical properties of anisotropically conductive adhesives (ACAs) joints through low temperature sintering of nano silver (Ag) particles were investigated and compared with that of the submicron-sized Ag-filled ACA and lead-free solder joints. The nano Ag particles used exhibited sintering behavior at significantly lower temperatures (< 200 degrees C) than at the bulk Ag melting temperature (960 degrees C). The sintered nano Ag particles significantly reduced the joint resistance and enhanced the current carrying capability of ACA joints. The improved electrical performance of ACA was attributed to the reduced interfaces between the Ag particles and the increased interfacial contact area between nano Ag particles and bond pads by the particle sintering. The reduced joint resistance was comparable to that of the lead-free (tin/3.5 silver/0.5 copper) metal solder joints. (c) 2005 Wiley Periodicals, Inc.