Previous Article Next Article Table of Contents Journal of the Electrochemical Society, Vol.153, No.3, L5-L5, 2006 DOI10.1149/1.2162179 Export Citation Electrodeposition of Cu on Ru barrier layers for damascene processing (vol 153, pg C37, 2005) Moffat TP, Walker M, Chen PJ, Bonevich JE, Egelhoff WF, Richter L, Witt C, Aaltonen T, Ritala M, Leskela M, Josella D Please enable JavaScript to view the comments powered by Disqus.
