A reactive ac pulsed dual magnetron Sputtering process for MgO thin-film deposition was equipped with a closed-loop control of the oxygen flow rate (F-O2) using the 285 nm magnesium radiation as input. Owing to this control, most of the unstable part of the partial pressure versus flowrate curve became accessible. The process worked steadily and reproducible without arcing. A dynamic deposition rate of up to 35 nm m/min could be achieved, which was higher than in the oxide mode by about a factor of 18. Both process characteristic and film properties were investigated in this work in dependence on the oxygen flow, i.e., in dependence on the particular point within the transition region where the process is operated. The films had very low extinction coefficients (< 5 X 10(-5)) and refractive indices close to the bulk value. They were nearly stoichiometric with a slight oxygen surplus (Mg/O=48/52) which was independent of the oxygen flow. X-ray diffraction revealed a prevailing (111) orientation. Provided that appropriate rf plasma etching was performed prior to deposition, no other than the (111) peak could be detected. The intensity of this peak increased with increasing F-O2, indicating an even more pronounced (111) texture. The ion-induced secondary electron emission coefficient (iSEEC) was distinctly correlated with the markedness of the (111) preferential orientation. Both refractive index and (111) preferred orientation (which determines the iSEEC) were found to be improved in comparison with the MgO growth in the fully oxide mode. Consequently, working in the transition mode is superior to the oxide mode not only with respect to the growth rate, but also to most important film properties. (c) 2006 American Vacuum Society.