화학공학소재연구정보센터
Macromolecular Research, Vol.14, No.3, 300-305, June, 2006
Positive-Type Photosensitive Polyimide Based on a Photobase Generator Containing Oxime-Urethane Groups as a Photosensitive Compound
E-mail:
The chemical structure of a semi-aromatic polyimide-I, which was prepared by the chemical imidization of cyclopentanetetracarboxylic dianhydride and 2,2-bis(4-aminophenyl)hexafluoropropane, was characterized by 13C-NMR spectroscopy. The chemically imidized polyimide-I was used for the preparation of a photosensitive polyimide (PSPI) through the addition of benzophenone and benzophenone oxime hexamethylene diurethane (BOHD), a photobase generator containing oxime-urethane groups. The polyimide-I film containing benzophenone and BOHD was not soluble in 2.38 wt% tetrabutylammonium hydroxide solution in H2O. However, it became soluble following irradiation with 310 nm UV light. A positive tone image with a resolution of 5 μm was obtained with this PSPI, having sensitivity (Dc) of 1.2 J/cm2 and contrast (γp) of 1.08. Thus, a polyimide, which is not intrinsically photosensitive, can become photosensitive through the addition of a photobase generator containing oxime-urethane groups as a photosensitive compound.
  1. Rabilloud G, Polymers in Electronics, Technip, Paris, 2000, Chapter 1
  2. Ahne H, Rubner R, Photosensitive Polyimides: Fundamentals and Applications, K. Horie, and T. Yamashita, Eds., Technomic, Lancaster, PA, 1995, p. 13
  3. Feger C, Franke H, ibid, Chapter 24
  4. Choi WS, Noh YY, Chae KH, Adv. Mater., 17, 833 (2005) 
  5. Lee SK, Jung BJ, Ahn T, Song IS, Shim HK, Macromolecules, 36(24), 9252 (2003) 
  6. Chandross EA, Houlihan FM, A. Partovi, X. S-W. Quan, and G. Venugopal, US Patent 6,045,977 (2000)
  7. Mckean DR, Wallraff GM, Volksen W, Hacker NP, Sanchez MI, Labadie JW, Proc. ACS Div. Polym. Mater. Sci. Eng., 66, 237 (1992)
  8. Mckean DR, Briffaud T, Volksen W, Hacker NP, Labadie JW, Polym. Prepr, 35, 387 (1994)
  9. Mckean DR, Wallraff GM, Volksen W, Hacker NP, Sanchez MI, Labadie JW, Polymers for Electronics: Resists and Dielectrics, ACS Symposium Series 537, L. F. Thompson, C. G. Willson, and S. Tagawa, Eds., ACS, Washington, D. C., 1994, Chapter 28, pp. 417-427
  10. Frechet JMJ, Cameron JF, Chung CM, Haque SA, Willson CG, Polym. Bull., 30, 369 (1993) 
  11. Mochizuki A, Teranishi T, Ueda M, Macromolecules, 28(1), 365 (1995) 
  12. Chae KH, Macromol. Rapid Commun., 19, 1 (1998)
  13. Chae KH, Park JH, Macromol. Res., 12(4), 352 (2004)
  14. Chae KH, Sung KH, J. Polym. Sci. A: Polym. Chem., 42(4), 975 (2004) 
  15. Chae KH, Jang HJ, J. Polym. Sci. A: Polym. Chem., 40(8), 1200 (2002) 
  16. Chae KH, Gwark JC, Chang T, Macromol. Rapid Commun., 21, 1007 (2000) 
  17. Chung EY, Choi SM, Sim HB, Kim KK, Kim DS, Kim KJ, Yi MH, Polym. Adv. Technol., 16, 19 (2005)