Imprint lithography generally requires heating to decrease the resist viscosity to achieve sufficient flow. Procedures using little or no heating are of interest for organic devices and for patterning materials on flexible plastic substrates. This article describes a procedure to imprint resist patterns at room temperature using commercial resist materials, where residual solvent remaining in the resist after spin coating is used to reduce the resist viscosity and enhance the deformation ability. This room temperature imprint shows results comparable with the elevated temperature processes done at 165 degrees C, suggesting similar resist viscosity under the conditions studied. The imprinted depth decreases with elapsed time after coating, consistent with time-dependent evaporation of solvent from the resist bulk. (c) 2006 American Vacuum Society.