화학공학소재연구정보센터
Thin Solid Films, Vol.508, No.1-2, 29-32, 2006
Thermal annihilation process of stacking-fault tetrahedron defect in Si-film epitaxy
Stacking-fault tetrahedron (SFT) is a nano- to micrometer size defect that is generated in epitaxialized films originating from impurity atoms on the substrate. The atomistic process of thermal annihilation of the SFT in Si(111) films was investigated using molecular dynamics simulations. We found that the SFT is annihilated by the movement of Shockley partial dislocations from the top Surface to the SFT bottom apex. (c) 2005 Elsevier B.V. All rights reserved.