Journal of Vacuum Science & Technology A, Vol.24, No.4, 1540-1545, 2006
Effects of TiOx physical vapor deposition parameters on the preferred orientation and adhesion of Pt films on gamma-Al2O3
TiOx physical vapor deposition (PVD) films were studied to improve the adhesion of Pt/AlN/Pt piezoelectric transducers on gamma-Al2O3/NiCoCrAlY/superalloy components. Thick (1.7-3.8 Am) TiOx films deposited by rf reactive cathodic sputtering on alpha-Al2O3 substrates were analyzed by x-ray diffraction (XRD) and scanning electron microscopy equipped with energy dispersive x-ray spectroscopy. The influence of substrate temperature (T-s), oxygen mole fraction in the plasma gas and annealing (1050 degrees C, 1 h, in air) on structural properties, morphology, and chemical composition of the films was observed. Thin (<= 10 nm) TiOx adhesion layers and Pt films were sputtered on alpha-Al2O3. The effects of TiOx deposition parameters, on the adhesion and the orientation of as-deposited and annealed Pt films were examined by tensile pull-off test and XRD, respectively. The results showed a (111) preferred orientation and good adhesion of Pt films. Finally, the selected TiO2 deposition parameters were applied on gamma-Al2O3/NiCoCrAlY/superalloy substrates. Adhesion properties of annealed Pt films on gamma-Al2O3 and TiOx/gamma-Al2O3 Were evaluated. The results showed a drastic improvement of the pull-off force (approximate to 0 to approximate to 100 MPa) by using the TiOx "glue layer." The adhesion layer also led to a pronounced (111) preferential orientation of the Pt films. (c) 2006 American Vacuum Society.