화학공학소재연구정보센터
Polymer Engineering and Science, Vol.46, No.9, 1318-1325, 2006
Curing behavior and structure of an epoxy/clay nanocomposite system
The curing behavior of an epoxy/clay nanocomposite system composed of a bifunctional epoxy resin with an aromatic amine curing agent and an organically modified clay was investigated. Differential scanning calorimetry (DSC) was used to investigate the curing behavior of the epoxy/clay nanocomposite system. The curing rate of the nanocomposite system increased with increasing clay content. A kinetic equation, considering an autocatalytic reaction mechanism, could describe fairly well the curing behavior of the epoxy/clay nanocomposite system. The reaction kinetic parameters of the kinetic equation were determined by fitting DSC conversion data to the kinetic equation, using a nonlinear numerical method. Dynamic mechanical analysis was used to investigate the thermomechanical properties of the epoxy/clay nanocomposite system. The glass transition temperature of the epoxy/clay nanocomposite system increased slightly with increasing clay content. The structure of the nanocomposite system was characterized by X-ray diffraction analysis and transmission electron microscope imaging. The formation of intercalated structures was observed dominantly in the epoxy/clay nanocomposites, together with some exfoliated structures.