Inertial interlock bonding (1113) was developed to provide a reliable low cost automated method for joining dissimilar metal plates at low bulk bonding temperatures for the production of sputtering targets. Joining dissimilar metals at elevated temperatures creates residual stress from the differential thermal expansion of the bimetallic plates. The IIB; method of joining dissimilar metal plates alleviates the need to increase the bulk temperature of the metal plates during bonding and thereby significantly reduces the residual stress. In IIB, the heat generated by inertial friction between two dissimilar metal plates is used to simultaneously (1) soften an intercalated ring that is forged into a matching T groove and (2) melt a thin solder layer that wets the other plate creating a reliable solder bond. While finite element modeling of the process indicates that the surface temperatures during bonding approach 1000 degrees C, the bulk temperature for the assembly remains below 70 degrees C. In this way, the differential thermal residual stress remains low, while a reliable bimetallic joint is formed. Results for joining tantalum to copper alloy plates for sputtering target applications are provided. (c) 2007 American Vacuum Society.