A new process technology for the wafer-level fabrication of surface acoustic wave (SAW) structures in piezoelectric LiNbO3 is reported. The complete Cu-based metallization system is embedded in the surface by applying the damascene technology. This technique includes ion based dry etching procedures, metallization by sputter deposition (physical vapor deposition) and electrochemical deposition, and finally planarization by chemical-mechanical polishing. The process steps were monitored by means of different evaluation techniques. SAW wave field measurements provided evidence for a good surface quality after planarization. (c) 2007 American Vacuum Society.