A novel in situ method for electroplating oxide coated metals is described.. Termed VORP, for voltage oxide removal for plating, the process utilizes a voltage pulse similar to 20-200 V, similar to 2 ms in duration, applied between working and counterelectrodes while both are immersed in a copper electrolyte. The pulse is almost immediately followed by galvanostatic plate-up. Adherent copper deposits up to similar to 4 mu m in height on stainless steel 316 coupons have been obtained. Temperature testing up to 260 degrees C in air does not affect the copper adhesion. A preliminary model for oxide removal is proposed utilizing concepts of dielectric breakdown. (c) 2007 American Vacuum Society.