Electroplating of thin films of copper onto steel substrate from acidic gluconate bath has been investigated under different conditions of bath composition, pH, current density, and temperature. A detailed study has been made about the effect of these parameters on potentiodynamic cathodic polarization, cathodic current efficiency (CCE%), and throwing power (TP) of the bath. Fine grained, highly adherent and smooth bright deposits were produced. X-ray diffraction analysis showed that these deposits were produced in one phase with crystalline cubic structure. The optimum conditions are: 10 g l(-1) CuSO4. 5H(2)O, 30 g l(-1) C6H11O7Na, 10 g l(-1) K2SO4, pH = 2.2, 1I= 2.8 mA cm(-2), and temperature range between 22 degrees C and 31 degrees C. The TP of the bath is greatly improved by increasing the current density.