In this paper, a simple method is presented for the fabrication of nickel (Ni) patterns on porous silicon (PS) substrates using a focused and scanned Ar+-laser beam. A commercially available electroless plating bath was operated as a precursor during the laser direct writing process. As a result, thin (t = 40-250 nm), narrow (w = 2-3 mum), uniform and conductive Ni deposits were formed on the surface of the PS. The deposits were characterized by profilometry, FESEM (equipped with EDX), FIB and resistance measurements.