The behavior of single and double gate accumulation mode silicon-on-insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs) is thoroughly investigated. Accumulation mode devices present advantages over inversion mode transistors regarding transconductance, ease of fabrication, and parasitic effects. We have concluded, from experimental results and 2D simulations, that short channel effects such as DIBL and subthreshold swing degradation are substantially reduced in the volume accumulation regime, being even lower in thin-film double gate accumulation mode SOI MOSFETs than in inversion mode double gate SOI devices for adequate technological characteristics. The potential of thin-film accumulation mode SOI MOS transistors down to sub-0.1 mum technologies and up to 125 degrees C is demonstrated.