Qualification of 300 mm SOICMOS substrate material: readiness for development and manufacturing

Hovel H; Almonte M; Tsai P; Lee JD; Maurer S; Kleinhenz R; Schepis D; Murphy R; Ronsheim P; Domenicucci A; Bettinger J; Sadana D

Solid-State Electronics, Vol.48, No.6, 1065-1072, 2004

DOI10.1016/j.sse.2003.12.023 Export Citation

Qualification of 300 mm SOICMOS substrate material: readiness for development and manufacturing

Hovel H, Almonte M, Tsai P, Lee JD, Maurer S, Kleinhenz R, Schepis D, Murphy R, Ronsheim P, Domenicucci A, Bettinger J, Sadana D

Sol substrates with 300 mm diameter have recently become available for use in circuit development. Little is known at present about the quality of these substrates and how they compare to the well-established 200 mm substrates. This paper outlines several physical and electrical characterization techniques and their use in comparing both bonded and SIMOX 300 and 200 mm Sol material. (C) 2004 Elsevier Ltd. All rights reserved.