Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives

Jin-Woo Lee; Jeh-Beck Ju; Joong-Do Kim

Korean Journal of Chemical Engineering, Vol.24, No.6, 960-964, November, 2007

DOI10.1007/s11814-007-0105-8 Export Citation

Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives

Jin-Woo Lee, Jeh-Beck Ju^{1, †}, and Joong-Do Kim

Semiconductor Material R&D Center, Samsung Techwin Co. LTD,, San 14, Nongseo-ri, Giheung-eup, Yongin-si, Gyeonggi-do 449-712, Korea
¹Department of Chemical Engineering, Hong-Ik University, 72-1, Sangsu-dong, Mapo-gu, Seoul 121-791, Korea

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This study is mainly concerned with the electrodeposition of palladium on the copper alloy lead frame used for semiconductor assembly process. The role and effect of additives on palladium electrodeposition were studied by using various electrochemical methods. Ortho-formylbenzenesulfonic acid as a primary additive was used in palladium plating on the lead frame in this study. The electrochemical characteristics of electrode reaction were measured by the hanging mercury drop electrode for electrochemical system and the qualities of the plated surface of lead frames were also examined. The additive agent in Pd solution could have been classified as the grain refiner. It acted as the electroactive species, which increased the polarization and decreased the roughness, by adsorption on the electrode in palladium pre-plated process. The reduction of palladium ion was identified to be an irreversible reaction and the diffusion coefficient of palladium ion and the reaction rate constant were obtained from chronopotentiometry experiment.

Keywords:Palladium;Electrodeposition;Lead Frame;Additives;Electrochemistry

[References]

Kim JD, Baek YH, Choi WS, Bok KS, Plat. and Surf. Fin., 86, 113 (1999)
Paek SK, Lee SH, Park SC, Proc. IMAPS2003, 2nd half Symposium, Korea (2003)
Dini JW, Electrodeposition, Noyes Publication, New Jersey (1994)
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Lovie, Et AL, United States Patent, 4,715,935 (1987)
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Brett CMA, Brett AMO, Electrochemistry, Oxford University Press, London (1993)
Le Penven R, Levason W, Pletcher D, J. Appl. Electrochem., 22, 421 (1992)
Lide DR, CRC hand book of chemistry and physics, 77th, Ed., CRC Press, Boca Raton (1996-1997)
Ogden C, Tench D, White J, J. Appl. Electrochem., 12, 619 (1982)
Troyon M, Wang L, Appl. Surf. Sci., 103, 517 (1996)
Yu J, Chen Y, Yang H, Huang Q, J. Electrochem., 146, 1798 (1999)
Crosby JN, Harrison JA, Whitfield TA, Electrochim. Acta, 26, 11 (1981)
Jaworski RK, Cox JA, J. Electroanal. Chem., 325, 111 (1992)

[Related Articles]

[1] Kim JD, Baek YH, Choi WS, Bok KS, Plat. and Surf. Fin., 86, 113 (1999)

[2] Paek SK, Lee SH, Park SC, Proc. IMAPS2003, 2nd half Symposium, Korea (2003)

[3] Dini JW, Electrodeposition, Noyes Publication, New Jersey (1994)

[4] Hartley FR, The chemistry of platinum and palladium, John Wiley and Sons, New York (1973)

[5] Lovie, Et AL, United States Patent, 4,715,935 (1987)

[6] Bard AJ, Faulkner LR, Electrochemical methods, John Wiley & Sons, Inc. , New York (1994)

[7] Brett CMA, Brett AMO, Electrochemistry, Oxford University Press, London (1993)

[8] Le Penven R, Levason W, Pletcher D, J. Appl. Electrochem., 22, 421 (1992)

[9] Lide DR, CRC hand book of chemistry and physics, 77th, Ed., CRC Press, Boca Raton (1996-1997)

[10] Ogden C, Tench D, White J, J. Appl. Electrochem., 12, 619 (1982)

[11] Troyon M, Wang L, Appl. Surf. Sci., 103, 517 (1996)

[12] Yu J, Chen Y, Yang H, Huang Q, J. Electrochem., 146, 1798 (1999)

[13] Crosby JN, Harrison JA, Whitfield TA, Electrochim. Acta, 26, 11 (1981)

[14] Jaworski RK, Cox JA, J. Electroanal. Chem., 325, 111 (1992)