- Previous Article
- Next Article
- Table of Contents
Journal of Industrial and Engineering Chemistry, Vol.13, No.6, 879-894, November, 2007
Electrorheological Properties of Polypyrrole and its Composite ER Fluids
E-mail:
Electrorheological (ER) fluids are suspensions of polarizable nonconducting or semiconducting particles in a nonconducting continuous phase of low relative polarizability. In the absence of an electric field, they have the properties of suspensions of neutral solid particles. Upon the application of an electric field, an organized structure of particles is formed and the ER fluids exhibit a remarkable change in rheological properties, including a drastic increase in apparent viscosity as well as yield stress. Various mechanisms have been proposed to explain the ER behavior to understand the ER behaviors and design effective ER fluids. Polypyrrole (PPy) is one of the most promising semiconducting polymers because it has higher conductivity and environmental stability than many other semiconducting polymers. PPy and its composites have been extensively used as ER materials and their ER fluids showed promising ER responses. ER properties of PPy based ER fluids (PPy, PPy copolymer, PPy coated particles, and PPy nanocomposites, etc.) and the ER behaviors of PPy based ER fluids such as shear, yield, and transient stress behavior and additive effect are reviewed.
Keywords:electrorheological fluid;electrorheology;semiconducting polymer;polypyrrole;yield stress;semiconducting polymer composite
- Winslow WM, J. Appl. Phys., 20, 1137 (1949)
- Hao T, Adv. Mater., 13(24), 1847 (2001)
- Gast AP, Zukoski CF, Adv. Colloid Interface Sci., 30, 153 (1989)
- Jordan TC, Shaw MT, IEEE Trans. Electr. Insul., 24, 849 (1989)
- Parthasarathy M, Klingenberg DJ, Mater. Sci. Eng. R-Rep., R17, 57 (1996)
- Hao T, Adv. Colloid Interface Sci., 97, 1 (2002)
- Deinega YF, Vinogradov GV, Rheol. Acta, 23, 636 (1984)
- Quadrat O, Stejskal J, J. Ind. Eng. Chem., 12(3), 352 (2006)
- Zhao XP, Yin JB, J. Ind. Eng. Chem., 12(2), 184 (2006)
- Maity A, Biswas M, J. Ind. Eng. Chem., 12(3), 311 (2006)
- Weiss KD, Carlson JD, J. Intell. Sys. Struture, 4, 13 (1993)
- Shulman ZP, Gorodkin RG, Korobko EV, J. Non-Newton. Fluid Mech., 8, 29 (1981)
- Bryant P, Lai K, Pialet W, US Patent 5 435 932 (1995)
- Sahin D, Sari B, Unal HI, Turkish J. Chem., 26, 113 (2002)
- Gario T, Adolf D, Hance B, in Proc. Int. Conf. ER Fluid., Ed. R. Tao, World Scientific, Singapore, p. 167 (1992)
- Jordan M, Schwendt A, Hill D, Burton S, Makris N, J. Rheol., 41, 75 (1997)
- Pialet W, Havelka O, US patent 5 879 582 (1999)
- Shilov VN, Deinega YF, Koll. Zhurn., 31, 908 (1969)
- Stangroom JE, Harness I, GB Patent 2153372 (1985)
- Stangroom JE, Phys. Techn., 14, 290 (1983)
- Kim YD, J. Colloid Interface Sci., 236(2), 225 (2001)
- Kim YD, Nam SW, J. Colloid Interface Sci., 269(1), 205 (2004)
- Klass DL, Martinek TW, J. Appl. Phys., 38, 67 (1967)
- Klass DL, Martinek TW, J. Appl. Phys., 38, 75 (1967)
- Adriani PM, Gast AP, Phys. Fluids, 31, 2757 (1988)
- Klingenberg DJ, van Frank S, Zukoski CF, J. Chem. Phys., 94, 6160 (1991)
- Chen Y, Sprecher AF, Conrad H, J. Appl. Phys., 70, 6796 (1991)
- Anderson RA, Langmuir, 10(9), 2917 (1994)
- Clarx HH, Bossis G, Phys. Rev. E, 48, 2721 (1993)
- Tao R, Jiang Q, Phys. Rev. Lett., 73, 2721 (1994)
- Davis LC, Appl. Phys. Lett., 60, 319 (1992)
- Davis LC, J. Appl. Phys., 73, 680 (1993)
- Davis LC, J. Appl. Phys., 72, 1334 (1992)
- Atten P, Foulc JN, Felici N, Int. J. Mod. Phys. B, 8, 2731 (1994)
- Foulc JN, Atten P, Felici N, J. Electrost., 33, 103 (1994)
- Block H, Kelly JP, J. Phys. D-Appl. Phys., 21, 1661 (1998)
- Tomizawa H, Kanbara M, Yoshimura N, Mitsui J, Hirano H, European Patent 0 342 041 (1989)
- Teare GC, Ratcliffe NM, J. Mater. Chem., 6, 301 (1996)
- Choi HJ, Cho MS, To K, Physica A, 254, 272 (1998)
- Kim YD, Song IC, J. Mater. Sci., 37(23), 5051 (2002)
- Park JH, Lim YT, Park OO, Macromol. Rapid Commun., 22(8), 616 (2001)
- Lu J, Zhao X, J. Mater. Chem., 12, 2603 (2002)
- Kim YD, Park DH, Colloid Polym. Sci., 280, 828 (2002)
- Kim YD, Park DH, Synth. Met., 142, 147 (2004)
- Gangopadhyay R, De A, Chem. Mater., 12, 608 (2000)
- Su SJ, Kuramoto M, Synth. Met., 114, 147 (2000)
- Hartsock DL, Novak RF, Chaundry GJ, J. Rheol., 35, 1305 (1991)
- Klingenberg DJ, Swol F, Zukoski CF, J. Chem. Phys., 91, 7888 (1989)
- Uejima H, Jpn. J. Appl. Phys., 11, 319 (1972)
- Tamura H, See H, Doi M, J. Phys. D-Appl. Phys., 26, 746 (1993)
- Tamura H, See H, Doi M, J. Phys. D-Appl. Phys., 26, 1181 (1993)
- Sugimoto N, Bull. JSME, 20, 1476 (1977)
- Shulman ZP, Deinega YF, Gorodkin RG, Matespuro AD, Prog. Heat Mass Transfer, 4, 109 (1971)
- Filisko FE, Radzilowski LH, J. Rheol., 34, 539 (1990)
- Gow C, Zukoski CF, J. Colloid Interface Sci., 136, 175 (1990)
- See H, Tamura H, Doi M, J. Phys. D-Appl. Phys., 26, 746 (1993)
- Kim YD, Klingenberg DJ, J. Colloid Interface Sci., 183(2), 568 (1996)
- Petrzhik GG, Chertkova OA, Trapeznikov AA, Dokl. Akad. Nauk SSSR, 253, 173 (1980)
- Kim YD, Nam SW, Park TJ, J. Ind. Eng. Chem., 9(5), 488 (2003)
- Kim YD, Lee MS, Korean J. Chem. Eng., 21(3), 567 (2004)
- Korobko EV, J. Intell. Sys. Struture, 3, 268 (1992)
- Klingenberg DJ, Van Swol F, Zukoski CF, J. Chem. Phys., 94, 6170 (1991)
- Bonnecaze RT, Brady JF, J. Rheol., 36, 1 (1992)
- Bailey P, Gillies DG, Heyes DM, Sutcliffe LH, Mol. Simul., 4, 137 (1989)
- Klingenberg DJ, Swol F, Zukoski CF, J. Chem. Phys., 94, 6160 (1991)
- See H, Saito T, Rheol. Acta, 35(3), 233 (1996)
- Ma H, Wen W, Tam WY, Sheng P, Phys. Rev. Lett., 77, 2499 (1996)
- Tang X, Wu C, Conrad H, J. Rheol., 39(5), 1059 (1995)
- Wu C, Conrad H, J. Phys. D-Appl. Phys., 29, 314 (1996)
- Trlica J, Quadrat O, Bradna P, Pavlinek V, Saha P, J. Rheol., 40(5), 943 (1996)
- Khusid B, Acrivos A, Phys. Rev. E, 52, 1669 (1995)
- Hao T, Kawai A, Ikazaki F, Langmuir, 14(5), 1256 (1998)
- Hao T, Kawai A, Ikazaki F, Langmuir, 15(4), 918 (1999)
- Hao T, Kawai A, Ikazaki F, Langmuir, 16(7), 3058 (2000)
- Wen W, Lu K, Appl. Phys. Lett., 68, 1046 (1996)
- Lan Y, Xu X, Men S, Lu K, Phys. Rev. E, 60, 4336 (1999)
- Sung JH, Cho MS, Choi HJ, Jhon MS, J. Ind. Eng. Chem., 10(7), 1217 (2004)
- Ikazaki F, Kawai A, Uchida K, Kawakami T, Edamura K, Sakurai K, Anzai H, Asako Y, J. Phys. D-Appl. Phys., 31, 336 (1998)
- Block H, Kelly JP, Qin A, Watson T, Langmuir, 6, 6 (1990)
- Kim JW, Liu F, Choi HJ, Hong SH, Joo J, Polymer, 44(1), 289 (2003)
- Kim SG, Kim JW, Choi HJ, Suh MS, Shin MJ, Jhon MS, Colloid Polym. Sci., 278, 894 (2000)
- Cho MS, Choi HJ, To KW, Macromol. Rapid Commun., 19(6), 271 (1998)
- Lengalova A, Pavlinek V, Saha P, Stejskal J, Quadrat O, J. Colloid Interface Sci., 258(1), 174 (2003)
- Kim JW, Kim SG, Choi HJ, Jhon MS, Macromol. Rapid Commun., 20(8), 450 (1999)
- Otsubo Y, Edamura K, J. Colloid Interface Sci., 168(1), 230 (1994)
- Trlica J, Saha P, Quadrat O, Stejskal J, J. Phys. D-Appl. Phys., 33, 1773 (2000)
- Wu SZ, Zeng F, Shen JR, Polym. J., 30, 451 (1998)
- Sohn JI, Kim JW, Kim BH, Joo J, Choi HJ, Mol. Cryst. Liq. Cryst., 377, 333 (2002)
- Kim JW, Liu F, Choi HJ, J. Ind. Eng. Chem., 8(4), 399 (2002)
- See H, Kawai A, Ilazaki F, Colloid Polym. Sci., 280, 24 (2002)
- Park DP, Sung JH, Lim ST, Choi HJ, Jhon MS, J. Mater. Sci. Lett., 22(18), 1299 (2003)
- Choi HJ, Cho MS, Kim JW, Kim CA, Jhon MS, Appl. Phys. Lett., 78, 3806 (2001)
- Cheng Q, Pavlinek V, Lengalova A, Li C, Belza T, Saha P, Microporous Mesoporous Mater., 94, 193 (2006)
- Woo DJ, Suh MH, Shin ES, Lee CW, Lee SH, J. Colloid Interface Sci., 288(1), 71 (2005)
- Han YM, Lim SC, Lee HG, Choi SB, Choi HJ, Mater. Des., 24, 53 (2003)
- Choi HJ, Jhon MS, Int. J. Mod. Phys. B, 13, 1901 (1999)
- Park BJ, Sung JH, Lee IS, Choi HJ, Chem. Phys. Lett., 414(4-6), 525 (2005)
- Tarcha PJ, Misun D, Wong M, Donovan JJ, In Polymer Latexes: Preparation, Chara- cterization and Applications, E. S. Daniels, E. D. Sudol, M. S. El-Aassar, Eds., ACS Symposium Series No. 492, American Chemical Society, Washington, DC, 22, 347 (1992)
- Simmons MR, Chaloner PA, Armes SP, Langmuir, 11(11), 4222 (1995)
- Armes SP, Gottesfeld S, Beery JG, Garzon F, Agnew SF, Polymer, 32, 2325 (1991)
- Maeda S, Armes SP, Chem. Mater., 7, 171 (1995)
- Yoon DJ, Kim YD, J. Colloid Interface Sci., 303(2), 573 (2006)
- Yoon DJ, Kim YD, J. Mater. Sci., 42, 5534 (2007)
- Ray SS, Biswas M, Synth. Met., 105, 99 (1999)
- Maity A, Biswas M, J. Appl. Polym. Sci., 90(4), 1058 (2003)
- Ballav N, Biswas M, Synth. Met., 132, 213 (2003)
- Maity A, Biswas M, Polym. Int., 54, 710 (2005)
- Maity A, Biswas M, J. Appl. Polym. Sci., 96(2), 276 (2005)
- Ray SS, Biswas M, J. Appl. Polym. Sci., 73(14), 2971 (1999)
- Wang J, Dai JH, Yarlagadda T, Langmuir, 21(1), 9 (2005)
- Kudoh Y, Synth. Met., 79, 17 (1996)
- Goodwin JW, Markham GM, Vincent B, J. Phys. Chem. B, 101(11), 1961 (1997)
- Kim YD, Park DH, Nam SW, Park TJ, Macromol. Res., 10(4), 215 (2002)
- Wu C, Conrad H, J. Phys. D-Appl. Phys., 31, 3312 (1998)
- Zhao H, Liu Z, Liu Y, Solid State Commun., 116, 321 (2000)
- Qi MC, Shaw MT, J. Appl. Polym. Sci., 65(3), 539 (1997)
- Tam W, Yi G, Wen W, Ma H, Loy M, Sheng P, Phys. Rev. Lett., 78, 2987 (1997)
- Kim JW, Noh MH, Choi HJ, Lee DC, Jhon MS, Polymer, 41(3), 1229 (2000)
- Nakatsuka K, Atarashi T, European Patent 0913 432 (1999)
- Edamura K, Otsubo Y, Mizoguchi M, US Patent 5 736 064 (1998)
- Katayana S, Yamada N, Yoshinaga I, Japanese Patent 10 140 171 (1998)
- Lascelles SF, Armes SP, J. Mater. Chem., 7, 1339 (1997)
- Fang FF, Choi HJ, J. Ind. Eng. Chem., 12(6), 843 (2006)
- Cheng QL, He Y, Pavlinek V, Lengalova A, Li CZ, Saha P, J. Mater. Sci., 41(15), 5047 (2006)
- Cheng Q, Pavlinek V, Lengalova A, Li C, He Y, Saha P, Microporous Mesoporous Mater., 93, 263 (2006)
- Marshall L, Zukoski CF, Goodwin JW, J. Chem. Soc.-Faraday Trans., 85, 2785 (1989)
- Klingenberg DJ, Dierking D, Zukoski CF, J. Chem. Soc.-Faraday Trans., 87, 425 (1991)
- Sprecher AF, Carlson JD, Conrad H, Mater. Sci. Eng., 95, 187 (1987)
- Martin JE, Anderson RA, J. Chem. Phys., 104(12), 4814 (1996)
- See H, J. Phys. D-Appl. Phys., 33, 1625 (2000)
- Duan X, Chen H, He Y, Luo W, J. Phys. D-Appl. Phys., 33, 696 (2000)
- Kim YD, De Kee D, AIChE J., 52(7), 2350 (2006)
- Park SJ, Cho MS, Lim ST, Choi HJ, Jhon S, Macromol. Rapid Commun., 26(19), 1563 (2005)
- Cho MS, Choi HJ, Jhon MS, Polymer, 46(25), 11484 (2005)
- Felici N, Foulc JN, Atten P, in R. Tao and G. D. Roy (eds), Electrorheological Fluids, Mechanisms, Properties, Technology, and Applications, Proc. of the Fourth Int. Conf. on ER Fluids, Feldkirch, Austria, Jul. 20-23, 1993, World Scientific, Singapore, p.139 (1994)
- Davis LC, Ginder JM, in F. E. Filisko and K. O. Havelka (eds.), Proc. of the ER Materials and Fluids Symposium, Washington, USA, Aug. 21-22, 1994 Plenum, New York (1995)
- Aizawa R, Vieira SL, Nakano M, Proceedings of the 7th International Conference on ER Fluids and MR Suspensions, Tao R. Ed., p. 595 (1999)
- Duan X, Luo W, Wu W, J. Phys. D-Appl. Phys., 33, 3102 (2000)
- Li J, Zhao L, Liu H, Solid State Commun., 107, 561 (1998)
- Zhu H, Kim Y, De Kee D, J. Non-Newton. Fluid Mech., 129(3), 177 (2005)