Previous Article Next Article Table of Contents Polymer Science and Technology, Vol.18, No.6, 542-548, December, 2007 Export Citation [특집] 탄소나노튜브의 열적 특성과 이를 이용한 전자패키지용 Thermal Interface Material 개발 동향 Thermal Interface Materials in Electronic Packages Using Thermal Conducting Properties of Carbon Nanotubes 이정섭, 전덕 Please enable JavaScript to view the comments powered by Disqus.
