비대칭 고리형 지방족 아민 경화제를 이용한 DGEBF 계열 에폭시의 경화 거동

김홍경; Hongkyeong Kim

Korean Chemical Engineering Research, Vol.46, No.1, 200-204, February, 2008

Export Citation

비대칭 고리형 지방족 아민 경화제를 이용한 DGEBF 계열 에폭시의 경화 거동

Cure Behavior of a DGEBF Epoxy using Asymmetric Cycloaliphatic Amine Curing Agent

김홍경^†

충주대학교 고분자공학과, 380-702 충북 충주시 이류면 대학로 72

Hongkyeong Kim^†

Department of Polymer Science and Engineering, Chungju National University, 72 Daehak-ro, Iryu-myeon, Chungju, Chungbuk 380-702, Korea

E-mail:

초록

비대칭성 고리형 지방족 아민 경화제를 이용한 diglycidyl ether of bisphenol F(DGEBF) 계열의 에폭시의 경화 반응을 등온 및 동적 경화 실험을 통하여 분석하였다. 등온 부분경화 실험 및 동적 경화반응을 통하여 아민 경화제의 비대칭성으로 인해 경화 반응이 저온부 및 고온부분의 두 가지 반응으로 구성되어 있다는 것을 확인하였고, 따라서 경화도가 0.6 이상인 영역에서는 등온경화반응 모델식을 이용하여 실험값을 예측하기는 어렵다는 것을 확인하였다. 승온 속도를 여러 가지로 변화시키며 동적 경화반응을 분석하여 저온부 및 고온부 각각의 반응에 대한 활성화에너지 및 속도 상수를 알아보았고, 경화 초기에는 저온부의 반응이 주가 되는 것을 확인하였다.

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

Keywords:Asymmetric Amine;Epoxy;Cure Kinetics;Partial Cure;Kissinger Method

[References]

May CA, Et AL, Epoxy resins. Chemistry and Technology, Marcel Dekker, New York (1988)
Rozenberg BA, Adv. Polym. Sci., 75, 113 (1985)
Gonzalez-Romero VM, Casillas N, ANTEC, 87, 1119 (1987)
Girardreydet E, Riccardi CC, Sautereau H, Pascault JP, Macromolecules, 28(23), 7599 (1995)
Lee SN, You WB, Polym. Eng. Sci., 27(17), 1317 (1987)
Wise CW, Cook WD, Goodwin AA, Polymer, 38(13), 3251 (1997)
Huguenin FGAE, Klein MT, Ind. Eng. Chem. Process Des. Dev., 24(1), 166 (1985)
Deng Y, Martin GC, Macromolecules, 27(18), 5147 (1994)
Kim BS, Chiba T, Inoue T, Polymer, 34(13), 2809 (1993)
Kim BS, Chiba T, Inoue T, Adv. Polym. Sci., 78, 83 (1986)
Yee AF, Pearson RA, J. Mater. Sci., 21(7), 2462 (1986)
Pearson RA, Yee AF, J. Mater. Sci., 21(7), 2475 (1986)
Barton JM, Polymer, 21(6), 603 (1980)
Camargo RE, Gonzalez VM, Macosko CW, Rubber Chem. Technol., 56(4), 774 (1983)
Hatakeyama T, Liu Z, Et AL, Handbook of Thermal Analysis, John Wiley & Sons, New York, 48 (1998)

[1] May CA, Et AL, Epoxy resins. Chemistry and Technology, Marcel Dekker, New York (1988)

[2] Rozenberg BA, Adv. Polym. Sci., 75, 113 (1985)

[3] Gonzalez-Romero VM, Casillas N, ANTEC, 87, 1119 (1987)

[4] Girardreydet E, Riccardi CC, Sautereau H, Pascault JP, Macromolecules, 28(23), 7599 (1995)

[5] Lee SN, You WB, Polym. Eng. Sci., 27(17), 1317 (1987)

[6] Wise CW, Cook WD, Goodwin AA, Polymer, 38(13), 3251 (1997)

[7] Huguenin FGAE, Klein MT, Ind. Eng. Chem. Process Des. Dev., 24(1), 166 (1985)

[8] Deng Y, Martin GC, Macromolecules, 27(18), 5147 (1994)

[9] Kim BS, Chiba T, Inoue T, Polymer, 34(13), 2809 (1993)

[10] Kim BS, Chiba T, Inoue T, Adv. Polym. Sci., 78, 83 (1986)

[11] Yee AF, Pearson RA, J. Mater. Sci., 21(7), 2462 (1986)

[12] Pearson RA, Yee AF, J. Mater. Sci., 21(7), 2475 (1986)

[13] Barton JM, Polymer, 21(6), 603 (1980)

[14] Camargo RE, Gonzalez VM, Macosko CW, Rubber Chem. Technol., 56(4), 774 (1983)

[15] Hatakeyama T, Liu Z, Et AL, Handbook of Thermal Analysis, John Wiley & Sons, New York, 48 (1998)