A partial nickel plating method was developed by using the organic gel electrolyte. The gel electrolyte was made from polyvinylchloride as a gelling agent and tetrahydrofuran as an organic solvent. The suitable conditions for nickel plating were investigated by the measurements of polarization curve and electrochemical impedance. The pattern electroplating using thin layer of gel electrolyte was carried out on the copper substrate. The substrate surface could be plated by nickel with high uniformity and sharp edge line. The present method will be widely used for the surface patterning without masking. (c) 2007 Elsevier Ltd. All rights reserved.