화학공학소재연구정보센터
Electrochimica Acta, Vol.53, No.1, 24-27, 2007
Electrodeposition of metallic tungsten films in ZnCl2-NaCl-KC1-KF-WO3 melt at 250 degrees C
WO3 hardly dissolved in ZnCl2-NaCl-KCl (0.60:0.20:0.20, in mole fraction) melt at 250 degrees C. The solubility Of WO3 increased by the addition of KF to the melt, which enabled electrodeposition of metallic tungsten. A smooth and fine film of metallic tungsten was obtained on a nickel substrate by the potentiostatic electrolysis at 0.06 V versus Zn(II)/Zn. The thickness reached ca. 2.5 mu m after 6-h electrolysis. The surface of the nickel contact probe pin manufactured by the conventional LIGA (Lithographie-Galvanoformung-Abformung, German abbreviation) process was successfully coated with a smooth and adhesive tungsten film by using this melt. (C) 2007 Elsevier Ltd. All rights reserved.