화학공학소재연구정보센터
Advanced Materials, Vol.19, No.19, 2919-2919, 2007
The direct patterning of nanoporous interlayer dielectric insulator films by nanoimprint lithography
Nanoscale parallel line-space patterns are imprinted into a spin-on organosilicate thin film that contains a second phase pore generating material (porogen). Imprints are converted into nanoporous low-dielectric patterns by vitrification at 430 degrees C where the porogen is volatilized and creates nanoscale pores (2.2 nm) in the vitrified organosilicate network (see figure). The results are well-defined, high-modulus, nanoporous patterns with an estimated dielectric constant of k-2.4.