화학공학소재연구정보센터
Polymer(Korea), Vol.33, No.1, 33-38, January, 2009
은 알킬카바메이트 복합체의 환원에 의한 은/폴리스티렌 비드의 제조
Preparation of Silver/Polystyrene Beads via in Sito Reduction of Silver Alkylcarbamate Complex
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초록
은 카바메이트 착체 화합물의 환원에 의한 무전해 도금법으로 은/폴리스티렌 비드를 제조하기 위하여 폴리스티렌 및 아민 관능기를 가지는 공중합체 비드를 제조하였다. 스티렌, divinylbenzene(DVB) 그리고 2-(N,N-dimethylamino) ethyl methacrylate(DAEMA) 단량체들을 poly(vinyl alcohol) 존재 하에서 물/메탄올을 용매로 사용하여 무유화중합을 진행하였다. 30/0∼1.5/0∼3 wt%의 단량체 조성을 가지는 poly(styrene/DVB/DAEMA) 비드는 구형으로 1 μm의 일정한 크기를 가지고 있었다. 아민 기능기를 가지는 폴리스티렌 비드의 무전해 도금은 비드의 전처리 없이 silver 2-ethylhexylcarbamate(Ag-EHCB) 복합체와 히드라진 환원제를 사용하여 메탄올 용액에서 진행하였다. 제조된 비드와 도금된 비드 표면의 형태를 SEM으로 관찰하였으며 은 도금된 비드를 분산시켜 자외선 흡수 변화 그리고 도금된 은의 성분을 XRD로 분석하였다.
Monodisperse polystyrene and its copolymer beads containing amine function were prepared for the electroless silver plating using reduction of silver alkylcarbamate complex in organic solvent. Soap-free emulsion polymerization was adopted for the polymerization of styrene, divinylbenzene(DVB), and 2-(N,N-dimethylamino)ethyl methacrylate (DAEMA) in the presence of poly(vinyl alcohol) in a water/methanol solvent. The resulting poly(styrene/DVB/DAEMA), containing 30/0∼1.5/0∼3 wt% in monomer composition, were found to be a sphere-type particle with diameter of 1 μm. Silver Agcoated polystyrene beads were prepared by in sito reduction of a silver 2-ethylhexylcarbamate (Ag-EHCB) complex solution with hydrazine without pretreatment of polystyrene beads. Robust Ag/polystyrene beads were analyzed by SEM, UV-visible spectrometer and XRD.
  1. Hajdu JB, Plat. Surf. Finish., 83, 29 (1996)
  2. Hidber PC, Helbig W, Kim E, Whitesides GM, Langmuir, 12(5), 1375 (1996)
  3. Kim DO, Jin JH, Shon WI, Oh SH, Polym.(Korea), 31(5), 410 (2007)
  4. Kim DO, Shon WI, Jin JH, Oh SH, Polym.(Korea), 31(3), 184 (2007)
  5. Park HK, Yoon JK, Kim K, Langmuir, 22(4), 1626 (2006)
  6. Kim K, Lee HB, Park HK, Shin KS, J. Colloid Interf. Sci., 318, 195 (2008)
  7. Tian ZQ, Ren B, Wu DY, J. Phys. Chem. B, 106(37), 9463 (2002)
  8. Doering WE, Nie SM, J. Phys. Chem. B, 106(2), 311 (2002)
  9. Chu W, LeBlanc RJ, Williams CT, Kubota J, Zaera F, J. Phys. Chem. B, 107(51), 14365 (2003)
  10. Lala NL, Deivaraj TC, Lee JY, Colloid Surface A, 269, 119 (2005)
  11. Hou ZZ, Dante S, Abbott NL, Stroeve P, Langmuir, 15(8), 3011 (1999)
  12. Hidber PC, Nealey PF, Helbig W, Whitesides GM, Langmuir, 12(21), 5209 (1996)
  13. Brown KR, Natan MJ, Langmuir, 14(4), 726 (1998)
  14. van de Putten AMT, de Bakker JWG, Fokkink LGJ, J. Electrochem. Soc., 139, 3475 (1992)
  15. Menon VP, Martin CR, Anal. Chem., 67, 1920 (1995)
  16. Hrapovic S, Liu YL, Enright G, Bensebaa F, Luong JHT, Langmuir, 19(9), 3958 (2003)
  17. Gittins DI, Susha AS, Schoeler B, Caruso F, Adv. Mater., 14(7), 508 (2002)
  18. Siiman O, Burshteyn A, J. Phys. Chem. B, 104(42), 9795 (2000)
  19. Jun BH, Kim JH, Park H, Kim JS, Yu KN, Lee SM, Choi H, Kwak SY, Kim YK, Jeong DH, Cho MJ, Lee YS, J. Comb. Chem., 9, 237 (2007)
  20. Lee JM, Lee YG, Kim DW, Oh C, Koo SM, Oh SG, Colloid Surface A, 301, 48 (2007)
  21. Xu X, Luo X, Zhuang H, Li W, Zhang B, Mater. Lett., 57, 3987 (2003)
  22. Dearden AL, Smith PJ, Shin DY, Reis N, Derby B, O'Brien P, Macromol. Rapid Commun., 26(4), 315 (2005)
  23. Park MS, Lim TH, Jeon YM, Kim JG, Gong MS, Joo SW, Macromol. Res., 16(4), 308 (2008)
  24. Park MS, Lim TH, Jeon YM, Kim JG, Joo SW, Gong MS, Sens. Actuators B, 133, 166 (2008)
  25. Park MS, Lim TH, Jeon YM, Kim JG, Joo SW, Gong MS, J. Colloid Interf. Sci., 321, 60 (2008)
  26. Alessio R, Dell'Amico DB, Calderazzo F, Englert U, Guarini A, Labella L, Strasser P, Helv. Chim. Acta, 18, 219 (1998)
  27. Dell'Amico DB, Calderazzo F, Labella L, Marchetti F, Pampaloni G, Chem. Rev., 103(10), 3857 (2003)