화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Korean Chemical Engineering Research, Vol.47, No.2, 141-149, April, 2009
Export Citation
구리 및 은 금속 배선을 위한 전기화학적 공정
Electrochemical Metallization Processes for Copper and Silver Metal Interconnection
권오중, 조성기1, 김재정1, †
  • 인천대학교 기계공학과, 402-749 인천시 남구 인천대길 319
  • 1서울대학교 화학생물공학부, 151-742 서울시 관악구 신림동 산 56-1
Oh Joong Kwon, Sung Ki Cho1, and Jae Jeong Kim1, †
  • Department of Mechanical Engineering, University of Incheon, 319 Incheondaegil, Nam-gu, Incheon 402-749, Korea
  • 1School of Chemical and Biological Engineering, Seoul National University, San 56-1, Sillim-dong, Kwanak-gu, Seoul 151-742, Korea
E-mail:
초록
초고속 연산용 CMOS(complementary Metal Oxide Semiconductor) 배선재료로 사용되고 있는 구리(Cu)가, 기가급 메모리 소자용 금속 배선 물질에도 사용이 시작되면서 구리 박막에 대한 재료 및 공정이 새로운 조명을 받고 있다. 반도체 금속 배선에 사용하는 수 nm 두께의 구리 박막의 형성에 전해도금(electrodeposition)과 무전해 도금(electroless deposition) 같은 전기화학적 방법을 이용하게 되어서 표면 처리, 전해액 조성과 같은 중요한 요소에 대한 최신 연구 동향을 요약하였다. 구리 박막에서 구리 배선을 제작하여야 하므로 새로운 패턴 기술인 상감기법이 도입되어, 구리도금과 상감기법과의 공정 일치성 관점에서 전해도금과 무전해 도금의 요소 기술에 대해 기술하였다. 구리보다 비저항이 낮아 차세대 소자용 배선에 있어서 적용이 예상되는 은(Ag)을 전기화학적 방법으로 금속 배선에 적용하는 최신 연구에 대하여도 소개하였다.
The Cu thin film material and process, which have been already used for metallization of CMOS(Complementary Metal Oxide Semiconductor), has been highlighted as the Cu metallization is introduced to the metallization process for giga - level memory devices. The recent progresses in the development of key elements in electrochemical processes like surface pretreatment or electrolyte composition are summarized in the paper, because the semiconductor metallization by electrochemical processes such as electrodeposition and electroless deposition controls the thickness of Cu film in a few nm scales. The technologies in electrodeposition and electroless deposition are described in the viewpoint of process compatibility between copper electrodeposition and damascene process, because a Cu metal line is fabricated from the Cu thin film. Silver metallization, which may be expected to be the next generation metallization material due to its lowest resistivity, is also introduced with its electrochemical fabrication methods.
Keywords:Copper;Silver;Electrodeposition;Electroless Deposition;Interconnection
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