The electrodeposition of Al-Mo-Ti ternary alloys was examined in the Lewis acidic 66.7-33.3% mole fraction aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl3-EtMeImCl) room-temperature ionic liquid containing (Mo6Cl8) Cl-4 and TiCl2. The Mo content in the alloys varied with the applied current density and the Mo(II)/Ti(II) concentration ratio. The content was small and constant at 0.6 +/- 0.2% atomic fraction (a/o) and was independent of the deposition conditions. All the electrodeposited Al-Mo-Ti alloys were dense and compact and adhered well to the copper substrate. The deposit surface morphology depended on the applied current density and the Mo content of the alloys, as reported previously for the amorphous binary Al-Mo alloys. However, no amorphous glass phase could be detected in the Al-Mo-Ti ternary alloy samples; this behavior may be related to the presence of Ti. In summary, the addition of a small amount of Ti ( similar to 1 a/o) to the binary Al- Mo alloys resulted in a ternary alloy with a substantially improved chloride-induced pitting corrosion resistance compared to the related Al- Mo alloy. (c) 2008 The Electrochemical Society.