Reversal imprint is used to pattern three-dimensional (3D) metal structures over substrates with complex topography. Metal films are deposited onto SU-8 polymer layers on glass molds, lithographically patterned, and transferred to Si or SU-8 substrates with nanosctructured surfaces by reversal imprint at 5 MPa, 80 C, and 1 s of UV exposure. The transfer of metal patterns of 50/20 nm thick Au/Ti and 0.5 mu m thick Al as well as 3D Al structures have been demonstrated. (C) 2008 American Vacuum Society.