We investigated a new method to form the line-and-space patterns with a nanometer-scale using the conventional optical lithography technique and the metal deposition/liftoff process. The ashing of the negative photo resist defined by the conventional optical lithography technique results in the proper profiles including a high aspect ratio (i.e., height/width value of the patterns) for the formation of nanometer-scale structures. We demonstrated that the metal electrodes with the nanometer-scale gap of 20 nm or less can be easily obtained by the newly proposed method without employing the highly sophisticated lithography tools including an electron beam lithography. (C) 2007 Elsevier B.V. All rights reserved.