The electrodeposition behavior of nickel was investigated at glassy carbon and polycrystalline copper electrodes in the 1-ethyl-3-methylimidazolium dicyanamide (EMI-DCA) room-temperature ionic liquid. Amperometric titration experiments suggest that Ni(II) reacted with DCA(-) anions forming [Ni(DCA)(4)](2-) complex anion, which could be reduced to nickel metal via a single-step electron transfer process. However, the anodic dissolution of the nickel deposits was sluggish. The electrodeposition of nickel proceeds via three-dimensional progressive nucleation with diffusion-controlled growth on both glassy and copper substrates. Scanning electron microscopy images of the nickel deposits indicated that the morphology of the nickel electrodeposits is dependent on the deposition potential. Atomic force microscopy topography illustrated that the roughness of the nickel-deposited surface increased with decreasing deposition potential. The crystalline nature of the nickel deposits was revealed by powder X-ray diffraction spectroscopy results which indicated that the grains size of the nickel deposits decreased with decreasing deposition potential. (C) 2008 Elsevier Ltd. All rights reserved.