An in situ method of plating onto aluminum using a laser to remove the surface oxide is described. The aluminum, acting as a cathode, in conjunction with a counter electrode (anode), is submerged in a copper or nickel plating solution with a small potential between them. A laser pulse is directed through the electrolyte onto the substrate in a single or several 10 ns pulses of 532 nm light. Adherent plating occurs only in the region where the light impinged to remove the inhibiting aluminum oxide. The technique opens the way for film depositions on aluminum without preprocessing steps.