Si wafers are widely used as a substrate material for fabricating ICs. The quality of ICs depends on the quality of Si wafers. The chemo-mechanical grinding (CMG) with soft abrasive grinding wheels (SAGW) has been recently found to be a great potential process for machining Si wafers to generate superior surface quality at low cost. However, there have been very few studies on observing variation of topography of scratch/texture and understanding basic eliminating process of scratch/texture on the ground Si wafer. Furthermore, few reports on the variation of surface roughness and material removal rate (MRR) during CMG process and relationship between MRR and surface roughness during CMG process are presented. In this paper, a series of CMG experiments have been conducted to study the elimination process of artificial scratches created on etched Si surfaces and residual textures induced by SD1500 diamond wheel in CMG process, and to understand the topography variations of Si surfaces and some basic grinding characteristics during CMG process. (C) 2008 Elsevier B.V. All rights reserved.