Electron-beam-induced deposition was used to create an ordered array of Pt seed clusters on a Au film onto which Cu was subsequently electrodeposited in the presence of additives. The Pt seed clusters were 25-30 nm diameter, positioned in square arrays of 200, 300, or 400 nm spacing, with overall dimensions of 5 x 5 mu m. Electrodeposition was carried out in an acid sulfate bath containing additives. Image analysis methods were used to evaluate the probability of finding Cu nuclei at a given distance from a Pt seed cluster, as well as finding the nearest neighbor to any deposited Cu nucleus. (C) 2008 The Electrochemical Society. [DOI: 10.1149/1.2992705] All rights reserved.